Flomerics’ FLO/PCB Software
Version 2 of Flomerics FLO/PCB software (shown on page
1), developed specifically to enable electronic and thermal
engineers to collaborate on printed circuit board (PCB) design,
provides a new 3-D viewer and a conduction-cooled operating
environment, and automatically calculates maximum power dissipation
for a given operating temperature.
The 3-D viewer in the new version allows designers to determine
the effect of the height of components on cooling issues.
The ability to simulate conduction-cooled environments makes
it possible to evaluate boards in sealed enclosures, such
as those found in military electronics and ruggedized systems.
FLO/PCB users can define maximum allowable junction temperatures
for components and the software will compute the maximum power
that can be dissipated without exceeding those temperatures.
Version 2 also provides thermal solutions for equivalent problems
in half the time of the previous version. Finally, new SmartParts
are available to represent RF shields.
FLO/PCB is a program for streamlining concept development
of PCBs, while ensuring good thermal design and accelerating
the PCB design process. FLO/PCB facilitates collaboration
between product marketing, electronics engineers and mechanical
engineers on PCB design, particularly during the conceptual