Flomerics’ FLO/PCB Software

Version 2 of Flomerics’ FLO/PCB software (shown on page 1), developed specifically to enable electronic and thermal engineers to collaborate on printed circuit board (PCB) design, provides a new 3-D viewer and a conduction-cooled operating environment, and automatically calculates maximum power dissipation for a given operating temperature.

The 3-D viewer in the new version allows designers to determine the effect of the height of components on cooling issues. The ability to simulate conduction-cooled environments makes it possible to evaluate boards in sealed enclosures, such as those found in military electronics and ruggedized systems. FLO/PCB users can define maximum allowable junction temperatures for components and the software will compute the maximum power that can be dissipated without exceeding those temperatures. Version 2 also provides thermal solutions for equivalent problems in half the time of the previous version. Finally, new SmartParts are available to represent RF shields.

FLO/PCB is a program for streamlining concept development of PCBs, while ensuring good thermal design and accelerating the PCB design process. FLO/PCB facilitates collaboration between product marketing, electronics engineers and mechanical engineers on PCB design, particularly during the conceptual phase.

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